Ultrasound

Fraunhofer Institute for Biomedical Engineering

Ultrasound DiPhAS system.
© Fraunhofer IBMT (Photo: Bernd Müller).

Equipment

  • phased array- and linear array ultrasound development systems
  • SMD assembly finepitch system
  • interconnection technology electronic: micro-soldering, wave soldering, reflow soldering
  • flowmetering: laboratory station for flows (Speckle Trecking, difference in time of flight; liquid: 7 m/s, DN 50/100/200; gas: variable up to 30 m/s, DN 200)
  • Universal ultrasonic measuring station for industrial applications (concrete, metal, plastics)
  • Cryostate measuring station for the characterisation of sensors and Zero Flow-detection
  • SPS development station (Siemens S6)
  • 8 channel system for difference in time of flight measurement in air
  • computer aided development system for electronic boards (ORCAD)
  • DSP- and microcontroller development kits (Microchip, Motorola)
  • FPGA-development kit
  • development dtation for industrial image processing (position, orientation, OCR, pattern matching)
  • fully parametrical 3D CAD systems (Pro/Engineer)
  • measuring technologies: Pygnometer, 3D-Soundfield-Scanner, Impendance Meter, Special Software for R&D, Surface Roughness Metering
  • interconnection technologies, sensor technologies: Lateral-Move-Adhering Sandwicher, Solder- and Bond Technologies
  • component preparation: Annular-diamant saw for direct cutting of precision components, vacuum mixer, lapping
  • single element, phased and linear array ultrasound development systems
  • acoustic microscope
  • Doppler systems
  • ultrasound laboratory
  • manufacturing equipment for ultrasound sensors in small and medium quantities
  • CNC flat bed grinding machine (Ziersch & Baltrusch)
  • precision lap- and polishing machines (Wolters)
  • CNC universal cutting machine (Mikron UM 600); working area (WA): 600x500x450mm
  • CNC tools cutting machine (Korradi UW 10 CNC); WA: 500x300x400mm
  • CNC drilling center (Weiler DZ 32 CNC); diameter 100mm, length 150m
  • CNC universal drilling machine (Rael Meka RT 5, cyclus operated); vertical 200mm, horizontal 600 mm
  • drilling machine Colchester Master VS 3250, diameter 1 - 300mm, length 650mm
  • CNC high-precision separation- and profile grinding machine (Berney T38-4 CNC), WA 160x220x120mm, NC round table 360?, cutting width min. about 20µm
  • CNC diamont saws (Disco DAD 321)
  • CNC micro drilling-cutting-grinding machine (Kern), WA 220x160x200mm, movabler NC round table, 5 axes
  • CNC laser cutting and welding equipment (Haas), YAG-laser with variable optical system, cutting width 60-200 µm, cuts of ceramics, metals, material thickness 5µm - 2mm
  • conventional drilling, cutting and grinding equiment
  • ribbon sawing automat, sawing area 200x200mm, +- 0,1mm
  • sand grinding equipment
  • test system for statical and dynamical pressure tests
  • precision dosage systems
  • 5 pool ultrasound cleaning equipment
  • plasma cleaning equipment
  • radiation-pressure balance
  • sound-field measurement station
  • impedance measuring system
  • insertion-loss measuring system
  • clima chambers
  • zero-flow measuring system
  • temperature shock chamber
  • 3 axes measurement system inclusive image processing and archiving